By Yiqing Chen
Diamond has a different mixture of houses, corresponding to the top hardness and thermal conductivity between any recognized fabric, excessive electric resistivity, a wide optical band hole and a excessive transmission, strong resistance to chemical erosion, low adhesion and friction, and intensely low thermal growth coefficient. As such, diamond has been a fascinating fabric in a variety of purposes in mechanical, chemical, optical, thermal and electric engineering. in lots of of the circumstances, the skin of a diamond part or aspect should have a superb end, usually all the way down to a floor roughness of nanometers. however, as a result of its severe hardness and chemical inertness, the sharpening of diamond and its composites has been a worldly approach.
Polishing of Diamond Materials will supply a cutting-edge research, either theoretically and experimentally, of the main well-known sharpening suggestions for mono/poly-crystalline diamond and chemical vapour deposition (CVD) diamond movies, together with mechanical, chemo-mechanical, thermo-chemical, excessive strength beam, dynamic friction and different sprucing recommendations. The in-depth discussions may be at the sharpening mechanisms, attainable modelling, fabric elimination fee and the standard keep watch over of those suggestions. A comparability in their benefits and downsides could be performed to supply the reader with an invaluable instruction for the choice and implementation of those sprucing techniques.
Polishing of Diamond Materials can be of curiosity to researchers and engineers in challenging fabrics and precision production, diamond providers, diamond jewelry providers and postgraduate scholars within the sector of precision production.
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Extra resources for Polishing of Diamond Materials: Mechanisms, Modeling and Implementation
2000). Diamond polishing: the dependency of friction and wear on load and crystal orientation. Journal of Physics. D. Applied Physics, 33, 985–990. Hall, D. , Hall Jr, H. , & Lauridsen, C. L. (1987). S. Patent No. 4,662,348. S. Patent and Trademark Office. Hird, J. , & Hayward, I. P. (2007). Investigating the mechanisms of diamond polishing using Raman spectroscopy. Philosophical Magazine, 87, 267–280. Hird, J. , & Field, J. E. (2004). Diamond polishing. Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, 460, 3547–3568.
5 MPa for polishing (Ralchenko and Pimenov 1998). The selection of diamond powder size is determined by the surface finish required; larger diamond powder provides higher polishing rates. A coarse powder (up to 40 μm) is used in the initial stage of polishing, which allows for fast material removal. 0 μm) can be used to obtain the desired final surface finish. However, the polishing time increases as the particle size decreases. 1 Polishing Technique and Equipment 27 Nowadays, the cast iron scaife is often replaced by a new type of diamond bonded polishing wheel in which the diamond powder is permanently bonded in a metal alloy matrix or an organic resin.
Tabor, D. (1965). In: R. ), Physical properties of diamond. Oxford: Clarendon Press. , & Seki, H. (1990). Triboattraction: Friction under negative load. Langmuir, 6, 1141–1148. Brookes, E. , & Xing, G. (1999). The plastic deformation and strain-induced fracture of natural and synthetic diamond. Diamond and Related Materials, 8, 1536–1539. Chen, R. , Zuo, D. , Lu, W. , Li, D. , & Wang, M. (2008). Study on mechanical polishing for CVD diamond films of forming nucleus surface and growing surface.