By Narayan Prabhu; ASTM Committee D-2 on Petroleum Products and Lubricants
"Eleven peer-reviewed papers deal with the environmental and health and wellbeing issues concerning the publicity to guide in the course of soldering and the good fortune and screw ups of lead-free solders. subject matters hide: components affecting the wetting habit of solders and evolution of interfacial microstructure ; Pb-free hot temperature solders for energy semiconductor units ; impact of floor roughness on wetting habit and evolution of microstructure of 2 lead loose solders on copper substrates ; Fatigue lifetime of SnBi comprehensive thin-small-outline-package (TSOP) elements less than thermal biking ; Microstructural points of the ductile-to-brittle transition ; Loading mixity at the interfacial failure mode in lead-free solder joint ; Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths. ; influence of the morphology of Cu6Sn5 intermetallic compound on tensile houses of bulk solder and solder joint ; Tensile houses of Sn-10Sb-5Cu hot temperature lead loose solder ; Empirical modeling and rheological characterization of solder pastes utilized in digital assemblies. STP 1530 is a helpful source for college students, researchers, and fabric scientists within the digital industry."--Publisher's website. Read more...
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Additional resources for Lead-free solders
5Ag and Sn-9Zn solders ͓2͔. The calculated EPL parameters are presented in Table 3 for both solder materials. High value of “K” results in rapid spreading in the initial stages of relaxation and a small value of n indicates that the liquid quickly spreads and attains equilibrium value of contact angle in a short period of time. The effect of roughness on EPL parameters was investigated. 5Zn solder are shown in Figs. 8 and 9. It was observed that both parameters ͑K and n͒ exhibited a decreasing trend with increasing substrate surface roughness.
Disk polishing on velvet cloth resulted in near uniform asperities, which results in the diffusion of a small amount of solder into the copper substrate that reacts with Cu to form a thin layer of IMC at the interface. Thin layer of IMC at the interface indicates poor wetting of solder. The uniform asperities of smooth surface act as barriers to the diffusion of liquid solder into the base metal. Hence, the solder material shows poor wettability on disk polished Cu substrates. 5Zn alloys, respectively.
97, 1997, pp. 1–5. Vaynman, S. and Fine, M. , “Development of Fluxes for Lead-Free Solders Containing Zinc,” Scr. , Vol. 41, No. 12, 1999, pp. 1269–1271. Peebles, D. , Peebles, H. , and Ohlhausen, J. , A, Vol. 144, 1998, pp. 89–114. Plas, H. A. , Cinque, R. , Vol. 48, No. 4, 1997, pp. 1–7. , “Evaluation of Lead ͑Pb͒-Free Ceramic Ball Grid Array ͑CBGA͒: Wettability, Microstructure and Reliability,” Electronic Components and Technology Conference, May 29–June 1, 2001, IEEE/ CPMT,ECA, Orlando, FL, pp.